Special Purpose Adhesive Formula Daquan (18)

Flexible epoxy resin polyamide adhesive

Component dosage /g component dosage /g
Bisphenol A Epoxy Resin 100 Butene-Ethylene-Styrene Copolymer Elastomer 6


Alcohol-soluble polyamides [sebacic acid-1,6-diamine hexahydro-2H-zepine (azepan-2-one-1,6-hexane diamine adiacetate polycondensate)] 15 diaminodiphenylmethane 20

Preparation and curing
According to the amount of the above formulation, each component was dissolved in a methanol-toluene mixed solvent to prepare a binder solution, which was coated on a 75 μm polyimide film and semi-cured at 90° C. for 5 min. This semi-cured film was laminated with 28.35 g of a 75 μm copper foil and hot-pressed at 160° C. for 30 minutes to obtain a cured laminate.

Use The glue has excellent chemical properties, heat resistance, softness, and excellent electrical properties. It is used for heat-resistant conductive bonding.

CLD-20 Structural Conductive Adhesive

Component dosage /g component dosage /g
Epoxy Resin Modified 100 Accelerator 2
Mixed curing agent 10-18 Electrolytic silver powder 200-400

Preparation and curing pot life 48h; 120 °C 3h curing.

Use The conductive adhesive has the advantages of longer pot life, high conductivity, high strength and good construction process, etc. It can be re-processed after bonding and can be widely used in various structural conductive bonding.

Anchor 401 Adhesive (DAD-2 Adhesive)

Component dosage /g component dosage /g
A, 90% polyester resin ethyl acetate solution 1 C, reduction method silver powder 10
B, 65%-70% polyester resin modified toluene diisocyanate solution 4

Preparation and curing Contact pressure, usually 5d or 60 °C 5h curing.

Use The glue is mainly used for the bonding of electronic devices.

DAD-3 Adhesive

Component dosage /g component dosage /g
Phenolic - polyvinyl formal 33 electrolytic silver powder 80
Solvent (benzene:ethanol=7:3) 67

Preparation and curing Curing for 2-3 h at 160 and 0.05-0.1 MPa pressure.

Purpose This adhesive is mainly used to bond large waveguide flanges, quartz crystal leads, and piezoelectric ceramics.

DAD-6 Adhesive

Component dosage /g component dosage /g
A, E-44 epoxy resin 10 B, 33% imidazole acetic acid solution 1.5
D-19 Epoxy Resin 3 C, Electrolytic Silver Powder 45
Diallyl Phthalate 1

Preparation and curing Curing for 5 h at 60 °C and 0.05 MPa pressure.

Use This adhesive is mainly used for bonding electronic tube conductive sealing graphite silver electrode.

DAD-4 Adhesive

Component dosage /g component dosage /g
A, zinc phenolic resin 4.5 E-44 epoxy resin 1.5
Polyvinyl acetaldehyde 3.5 B, 2-ethyl-4 methyl imidazole 0.24
Ethyl acetate and anhydrous ethanol (7:3) 20.5 C, reduced silver powder 20

Preparation and curing Curing was carried out at a pressure of 0.05 MPa, 80°C for 1 hour, and then cured at 130°C for 4 hours.

Use The glue is often used for bonding electronic devices used at high temperatures.

DAD-5 Adhesive

Component dosage /g component dosage /g
A. Amino polyfunctional epoxy resin 0.9 B, 2-ethyl-4 methyl imidazole 0.1
Nitrile rubber -40 0.1 C, electrolytic silver powder 2.5

Preparation and curing Curing for 3 h at a pressure of 0.05-0.1 MPa and 100°C.

Use This glue replaces soldering in the edge of the valve.

3011 conductive adhesive

Component dosage /g component dosage /g
Zinc phenolic resin 10 Electrolytic silver 37.5
Polyvinyl butyral 5 Ethanol 47.5

Preparation and curing Curing at 60°C for 1 hour and curing at 150°C for 2 hours.

Use This glue is mainly used for the bonding of copper and aluminum waveguide elements.

303 conductive adhesive

Component dosage /g component dosage /g
A. Polyvinyl butyral modified resorcin Trioxymethylene 5.3
Formaldehyde Resin Ethanol Solution (25%-30%) C, Sodium Hydroxide Ethanol Solution (5%-10%)
B. Electrolytic silver powder 94.7 A:B:C=1:3.8:0.05

Preparation and curing 24 hours at room temperature curing.

Use The glue is used for bonding electronic components at 100°C.

305 conductive adhesive

Component dosage /g component dosage /g
420 Nylon Epoxy Adhesive 4 Solvent (Methanol: Benzene = 7:2) Appropriate Reducing Silver Powder 3

Preparation and curing of the job at 165 °C and 0.1-0.3MPa pressure curing 1-2h.

Use The glue is mainly used for conductive bonding of metal parts at -60-120°C.

HXJ-13 conductive adhesive

Component dosage /g component dosage /g
E-51 epoxy resin 100-phenylene diamine 7.5
Polyamide 50 Precipitated Silver 450

Preparation and curing Curing at 0°C for 3h and curing at 115°C for 1h.

Use The glue is mainly used for bonding electronic devices.

Conductive plastic

Component dosage /g component dosage /g
509 phenolic epoxy resin 100 benzyl dimethylamine 7.5
647 anhydride 67.3 precipitated silver 450

Preparation and curing Curing at 100°C for 2 hours and curing at 140°C for 2 hours.

Use This glue is used for heat-resistant primary structure bonding.

902 conductive adhesive

Component A, ethyl acetate solution of polyester resin

B. Polyethyl isocyanate solution in ethyl acetate

C, silver powder

A:B:C=1:2:7

Preparation and curing Curing at room temperature for 2 days, or curing at 80°C for 1.5 hours.

Use The adhesive is resistant to heat and cold, and has three-fold alternating strength at -80-150°C. Its strength is constant and it is mainly used for bonding instruments.

Epoxy conductive adhesive

Component dosage /g component dosage /g
E-42 epoxy resin 100 triethanolamine 15
Dibutyl phthalate 10 Silver powder 75
590 thinner 5 100

Prepare and cure at 80°C for 4 hours.



Source: 21st Century Fine Chemicals Network

Use The glue is used to bond metal parts.