Epoxy resin HC-1 adhesive formula

Component dosage /g component dosage /g
A , epoxy resin 634 100 silane coupling agent B201 3
Glycerin epoxy resin 662 20 Alumina powder ( 300 mesh) 50
Phenyl Glycidyl Ether 690 10 A : B=130 : 193
B , polyamide resin 650 140   
Preparation and curing   First, according to the amount of preparation of two components of A and B, can be mixed evenly. Curing conditions are 24 h at 25 °C, or 2 h at 80 °C.
use   For metal, ceramic, hard plastic bonding.